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PCB设计中专业英译术语之基材的材料
2018-05-07 11:57
1. A阶树脂：A-stage resin
2. B阶树脂：B-stage resin 3. C阶树脂：C-stage resin 4. 环氧树脂：epoxy resin 5. 酚醛树脂：phenolic resin 6. 聚酯树脂：polyester resin 7. 聚酰亚胺树脂：polyimide resin 8. 双马来酰亚胺三嗪树脂：bismaleimide-triazine resin 9. 丙烯酸树脂：acrylic resin 10. 三聚氰胺甲醛树脂：melamine formaldehyde resin 11. 多官能环氧树脂：polyfunctional epoxy resin 12. 溴化环氧树脂：brominated epoxy resin 13. 环氧酚醛：epoxy novolac 14. 氟树脂：fluroresin 15. 硅树脂：silicone resin 16. 硅烷：silane 17. 聚合物：polymer 18. 无定形聚合物：amorphous polymer 19. 结晶现象：crystalline polamer 20. 双晶现象：dimorphism 21. 共聚物：copolymer 22. 合成树脂：synthetic 23. 热固性树脂：thermosetting resin 24. 热塑性树脂：thermoplastic resin 25. 感旋光性树脂：photosensitive resin 26. 环氧当量：weight per epoxy equivalent (WPE) 27. 环氧值：epoxy value 28. 双氰胺：dicyandiamide 29. 粘结剂：binder 30. 胶粘剂：adesive 31. 固化剂：curing agent 32. 阻燃剂：flame retardant 33. 遮光剂：opaquer 34. 增塑剂：plasticizers 35. 不饱和聚酯：unsatuiated polyester 36. 聚酯薄膜：polyester 37. 聚酰亚胺薄膜：polyimide film (PI) 38. 聚四氟乙烯：polytetrafluoetylene (PTFE) 39. 聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP) 40. 增强材料：reinforcing material 41. 玻璃纤维：glass fiber 42. E玻璃纤维：E-glass fibre 43. D玻璃纤维：D-glass fibre 44. S玻璃纤维：S-glass fibre 45. 玻璃布：glass fabric 46. 非织布：non-woven fabric 47. 玻璃纤维垫：glass mats 48. 纱线：yarn 49. 单丝：filament 50. 绞股：strand 51. 纬纱：weft yarn 52. 经纱：warp yarn 53. 但尼尔：denier 54. 经向：warp-wise 55. 纬向：weft-wise, filling-wise 56. 织物经纬密度：thread count 57. 织物组织：weave structure 58. 平纹组织：plain structure 59. 坏布：grey fabric 60. 稀松织物：woven scrim 61. 弓纬：bow of weave 62. 断经：end missing 63. 缺纬：mis-picks 64. 纬斜：bias 65. 折痕：crease 66. 云织：waviness 67. 鱼眼：fish eye 68. 毛圈长：feather length 69. 厚薄段：mark 70. 裂缝：split 71. 捻度：twist of yarn 72. 浸润剂含量：size content 73. 浸润剂残留量：size residue 74. 处理剂含量：finish level 75. 浸润剂：size 76. 偶联剂：couplint agent 77. 处理织物：finished fabric 78. 聚酰胺纤维：polyarmide fiber 79. 聚酯纤维非织布：non-woven polyester fabric 80. 浸渍绝缘纵纸：impregnating insulation paper 81. 聚芳酰胺纤维纸：aromatic polyamide paper 82. 断裂长：breaking length 83. 吸水高度：height of capillary rise 84. 湿强度保留率：wet strength retention 85. 白度：whitenness 86. 陶瓷：ceramics 87. 导电箔：conductive foil 88. 铜箔：copper foil 89. 电解铜箔：electrodeposited copper foil (ED copper foil) 90. 压延铜箔：rolled copper foil 91. 退火铜箔：annealed copper foil 92. 压延退火铜箔：rolled annealed copper foil (RA copper foil) 93. 薄铜箔：thin copper foil 94. 涂胶铜箔：adhesive coated foil 95. 涂胶脂铜箔：resin coated copper foil (RCC) 96. 复合金属箔：composite metallic material 97. 载体箔：carrier foil 98. 殷瓦：invar 99. 箔（剖面）轮廓：foil profile 100. 光面：shiny side 101. 粗糙面：matte side 102. 处理面：treated side 103. 防锈处理：stain proofing 104. 双面处理铜箔：double treated foil 以上即是PCB设计中专业英译术语之基材的材料，下期预告：PCB设计中专业英译术语之设计，更多更多行业信息可查阅快点学院订阅号：eqpcb_cp。  |
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