MT6589_Technical_Brief|项目开源 - 逆天PCB论坛

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MT6589_Technical_Brief :
Table of Contents
Document Revision History  ..................................................................................................................  2
Table of Contents  ...................................................................................................................................  3
1  System Overview  ..........................................................................................................................  6
1.1  Platform Features  .................................................................................................................  7
1.2  MODEM Features  .................................................................................................................  8
1.3  Multimedia Features  .............................................................................................................  9
1.4  General Descriptions  ..........................................................................................................  10
2  Product Description  ...................................................................................................................  12
2.1  Pin Description....................................................................................................................  12
2.1.1  Ball Map View  .....................................................................................................  12
2.1.2  Pin Coordinate  ....................................................................................................  13
2.1.3  Detailed Pin Description  .....................................................................................  17
2.2  Electrical Characteristic  ......................................................................................................  29
2.2.1  Absolute Maximum Ratings ...............................................................................  29
2.2.2  Recommended Operating Conditions  ................................................................  30
2.2.3  Storage Condition  ...............................................................................................  31
2.2.4  AC Electrical Characteristics and Timing Diagram  ............................................  31
2.3  System Configuration  .........................................................................................................  34
2.3.1  Mode Selection  ...................................................................................................  34
2.3.1  Constant Tie Pins  ...............................................................................................  34
2.4  Power-on Sequence  ...........................................................................................................  35
2.5  Analog Baseband  ...............................................................................................................  36
2.5.1  BBRX  ..................................................................................................................  37
2.5.2  BBTX  ..................................................................................................................  39
2.5.3  2GBBTX  .............................................................................................................  41
2.5.4  APC-DAC  ...........................................................................................................  42
2.5.5  VBIAS-DAC  ........................................................................................................  43
2.5.6  AUXADC ............................................................................................................  44
2.5.7  Clock Squarer  .....................................................................................................  46
2.5.8  Phase Locked Loop............................................................................................  46
2.5.9  Temperature Sensor ..........................................................................................  51
2.6  Package Information  ...........................................................................................................  52
2.6.1  Package Outlines  ...............................................................................................  52
2.6.2  Thermal Operating Specifications  ......................................................................  52
2.6.3  Lead-free Packaging  ..........................................................................................  52
2.7  Ordering Information  ...........................................................................................................  53
2.7.1  Top Marking Definition .......................................................................................  53

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