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Document Revision History .................................................................................................................. 2 |
Table of Contents ................................................................................................................................... 3 |
1 System Overview .......................................................................................................................... 6 |
1.1 Platform Features ................................................................................................................. 7 |
1.2 MODEM Features ................................................................................................................. 8 |
1.3 Multimedia Features ............................................................................................................. 9 |
1.4 General Descriptions .......................................................................................................... 10 |
2 Product Description ................................................................................................................... 12 |
2.1 Pin Description.................................................................................................................... 12 |
2.1.1 Ball Map View ..................................................................................................... 12 |
2.1.2 Pin Coordinate .................................................................................................... 13 |
2.1.3 Detailed Pin Description ..................................................................................... 17 |
2.2 Electrical Characteristic ...................................................................................................... 29 |
2.2.1 Absolute Maximum Ratings ............................................................................... 29 |
2.2.2 Recommended Operating Conditions ................................................................ 30 |
2.2.3 Storage Condition ............................................................................................... 31 |
2.2.4 AC Electrical Characteristics and Timing Diagram ............................................ 31 |
2.3 System Configuration ......................................................................................................... 34 |
2.3.1 Mode Selection ................................................................................................... 34 |
2.3.1 Constant Tie Pins ............................................................................................... 34 |
2.4 Power-on Sequence ........................................................................................................... 35 |
2.5 Analog Baseband ............................................................................................................... 36 |
2.5.1 BBRX .................................................................................................................. 37 |
2.5.2 BBTX .................................................................................................................. 39 |
2.5.3 2GBBTX ............................................................................................................. 41 |
2.5.4 APC-DAC ........................................................................................................... 42 |
2.5.5 VBIAS-DAC ........................................................................................................ 43 |
2.5.6 AUXADC ............................................................................................................ 44 |
2.5.7 Clock Squarer ..................................................................................................... 46 |
2.5.8 Phase Locked Loop............................................................................................ 46 |
2.5.9 Temperature Sensor .......................................................................................... 51 |
2.6 Package Information ........................................................................................................... 52 |
2.6.1 Package Outlines ............................................................................................... 52 |
2.6.2 Thermal Operating Specifications ...................................................................... 52 |
2.6.3 Lead-free Packaging .......................................................................................... 52 |
2.7 Ordering Information ........................................................................................................... 53 |
2.7.1 Top Marking Definition ....................................................................................... 53 |
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