代码 | 相关对象 | 说明 |
单一字符代码 |
L |
Line |
走线 |
P |
Pin |
元件脚 |
V |
Via |
贯穿孔 |
K |
Keep in/out |
允许区域/禁止区域 |
C |
Component |
元件层级 |
E |
Electrical Constraint |
电气约束 |
J |
T-Junction |
呈现T形的走线 |
I |
Island Form |
被Pin或Via围成的负片孤铜 |
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错误代码前置码说明 |
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W |
Wire |
与走线相关的错误 |
D |
Design |
与整个电路板相关的错误 |
M |
Soldemask |
与防焊层相关的错误 |
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错误代码后置码说明 |
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S |
Shape/Stub |
与走线层的Shape或分支相关的错误 |
N |
Not Allowed |
与不允许的设置相关的错误 |
W |
Width |
与宽度相关的错误 |
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双字符错误代码 |
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BB |
Bondpad to Bondpad |
Bondpad之间的错误 |
BL |
Bondpad to Line |
Bondpad与Line之间的错误 |
BS |
Bondpad to Shape |
Bondpad与Shape 之间的错误 |
CC |
Package to Package |
Package之间的 Spacing 错误 |
Symbol Soldermask to Symbol |
Soldermask零件防焊层之间的Spacing 错误 |
DF |
Differential Pair Length Tolerance |
差分对走线的长度误差过长 |
Differential Pair Primary Max Separation |
差分对走线的主要距离太大 |
Differential Pair Secondary Max Separation |
差分对走线的次要距离太大 |
Differential Pair Secondary Max Length |
差分对走线的次要距离长度过长 |
DI |
Design Constraint Negative Plane Island |
负片孤铜的错误 |
ED |
Propagation-Delay |
走线的长度错误 |
Relative-Propagation-Delay |
走线的等长错误 |
EL |
Max Exposed Length |
走线在外层(TOP&BOTTOM)的长度过长 |
EP |
Max Net Parallelism Length-Distance Pair |
已超过Net之间的平行长度 |
ES |
Max Stub Length |
走线的分支过长 |
ET |
Electrical Topology |
走线连接方式的错误 |
EV |
Max Via Count |
已超过走线使用的VIA的最大数目 |
EX |
Max Crosstalk |
已超过Crosstalk值 |
Max Peak Crosstalk |
已超过Peak Crosstalk值 |
HH |
Hold to Hold Spacing |
钻孔之间的距离太近 |
HW |
Diagonal Wire to Hold Spacing |
斜线与钻孔之间的距离太近 |
Hold to Orthogonal Wire Spacing |
钻孔与垂直/水平线之间的距离太近 |
IM |
Impedance Constraint |
走线的阻抗值错误 |
JN |
T Junction Not Allowed |
走线呈T形的错误 |
KB |
Route Keepin to Bondpad |
Bondpad在Keepin之外 |
Route keepout to Bondpad |
Bondpad在keepout之内 |
Via Keepout to Bondpad |
Bondpad在Via Keepout之内 |
KC |
Package to Place Keepin Spacing |
元件在Place Keepin之外 |
Package to Place Keepout Spacing |
元件在Place Keepout之内 |
KL |
Line to Route Keepin Spacing |
走线在Route Keepin之外 |
Line to Route Keepout Spacing |
走线在Route Keepout之内 |
KS |
Shape to Route Keepin Spacing |
Shape在Route Keepin之外 |
Shape to Route Keepout Spacing |
Shape在Route Keepout之内 |
KV |
BBVia to Route Keepin Spacing |
BBVia在Route Keepin之外 |
BBVia to Route Keepout Spacing |
BBVia在Route Keepout之内 |
BBVia to Via Keepout Spacing |
BBVia在Via Keepout之内 |
Test Via to Route Keepin Spacing |
Test Via在Route Keepin之外 |
Test Via to Route Keepout Spacing |
Test Via在Route Keepout之内 |
Test Via to Via Keepout Spacing |
Test Via在Via Keepout之内 |
Through Via to Route Keepin Spacing |
Through Via在Route Keepin之外 |
Through Via to Route Keepout Spacing |
Through Via在Route Keepout之内 |
Through Via to Via Keepout Spacing |
Through Via在Via Keepout之内 |
LB |
Min Self Crossing Loopback Length |
无 |
LL |
Line to Line Spacing |
走线之间太近 |
LS |
Line to Shape Spacing |
走线与Shape 太近 |
LW |
Min Line Width |
走线的宽度太细 |
Min Neck Width |
走线变细的宽度太细 |
MA |
Soldermask Alignment Error Pad |
Soldermask Tolerance太小 |
MC |
Pin/Via Soldermask to Symbol Soldermask |
Pad与Symbol Soldermask之间的错误 |
MM |
Pin/Via Soldermask to Pin/Via Soldermask |
Pad Soldermask之间的错误 |
PB |
Pin to Bondpad |
Pin与Bondpad之间的错误 |
PL |
Line to SMD Pin Spacing |
走线与SMD元件脚太近 |
Line to Test Pin Spacing |
走线与Test元件脚太近 |
Line to Through Pin Spacing |
走线与Through元件脚太近 |
PP |
SMD Pin to SMD Pin Spacing |
SMD元件脚与SMD元件脚太近 |
SMD Pin to Test Pin Spacing |
SMD元件脚与Test元件脚太近 |
Test Pin to Test Pin Spacing |
Test元件脚与Test元件脚太近 |
Test Pin to Through Pin Spacing |
Test元件脚与Through元件脚太近 |
Through Pin to SMD Pin Spacing |
Through元件脚与SMD元件脚太近 |
Through Pin to Through Pin Spacing |
Through元件脚与Through元件脚太近 |
PS |
Shape to SMD Pin Spacing |
Shape与SMD元件脚太近 |
Shape to Test Pin Spacing |
Shape与Test元件脚太近 |
Through Pin to Shape Spacing |
Through元件脚与Shape太近 |
PV |
BBVia to SMD Pin Spacing |
BBVia与SMD元件脚太近 |
BBVia to Test Pin Spacing |
BBVia与Test元件脚太近 |
BBVia to Through Pin Spacing |
BBVia 与Through元件脚太近 |
SMD Pin to Test Via Spacing |
SMD Pin与Test Via太近 |
SMD Pin to Through Via Spacing |
SMD Pin与Through Via太近 |
Test Pin to Test Via Spacing |
Test Pin与Test Via太近 |
Test Pin to Through Via Spacing |
Test Pin与Through Via太近 |
Test Via to Through Pin Spacing |
Test Via与Through Pin太近 |
Through Pin to Through Via Spacing |
Through Pin与Through Via太近 |
RC |
Package to Hard Room |
元件在其他的Room之内 |
RE |
Min Length Route End Segment at 135Degree |
无 |
Min Length Route End Segment at 45/90Degree |
无 |
SB |
135Degree Turn to Adjacent Crossing Distance |
无 |
90Degree Turn to Adjacent Crossing Distance |
无 |
SL |
Min Length Wire Segment |
无 |
Min Length Single Segment Wire |
无 |
SN |
Allow on Etch Subclass |
允许在走线层上 |
SO |
Segment Orientaion |
无 |
BB |
Bondpad to Bondpad |
Bondpad之间的错误 |
SS |
Shape to Shape |
Shape之间的错误 |
TA |
Max Turn Angle |
无 |
VB |
Via to Bondpad |
Via 与Bondpad之间的错误 |
VG |
Max BB Via Stagger Distance |
同一段线的BB Via之间的距离太长 |
Min BB Via Gap |
BB Via之间太近 |
Min BB Via Stagger Distance |
同一段线的BB Via之间的距离太近 |
Pad/Pad Direct Connect |
Pad 在另一个Pad 之上 |
VL |
BB Via to Line Spacing |
BB Via与走线太近 |
Line to Through Via Spacing |
走线与Through Via太近 |
Line to Test Via Spacing |
走线与Test Via太近 |
VS |
BB Via to Shape Spacing |
BB Via与Shape太近 |
Shape to Test Via Spacing |
Shape 与Test Via太近 |
Shape to Through Via Spacing |
Shape与Through Via太近 |
VV |
BB Via to BB Via Spacing |
BB Via之间太近 |
BB Via to Test Via Spacing |
BB Via与Test Via太近 |
BB Via to Through Via Spacing |
BB Via与Through Via太近 |
Test Via to Test Via Spacing |
Test Via之间太近 |
Test Via to Through Via Spacing |
Test Via与Through Via太近 |
Through Via to Through Via Spacing |
Through Via之间太近 |
WA |
Min Bonding Wire Length |
Bonding Wire 长度太短 |
WE |
Min End Segment Length |
无 |
Min Length Wire End Segment at 135Degree |
无 |
Min Length Wire End Segment at 45/90Degree |
无 |
WI |
Max Bonding Wire Length |
Bonding Wire 长度太长 |
WW |
Diagonal Wire to Diagonal Wire Spacing |
斜线之间太近 |
Diagonal Wire to Orthogonal Wire Spacing |
斜线与垂直/水平线之间的距离太近 |
Orthogonal Wire to Orthogonal Wire Spacing |
垂直/水平线之间的距离太近 |
WX |
Max Number of Crossing |
无 |
Min Distance between Crossing |
无 |
XB |
135 Degree Turn to Adjacent Crossing Distance |
无 |
90 Degree Turn to Adjacent Crossing Distance |
无 |
XD |
Externally Determined Violation |
无 |
XS |
Crossing to Adjacent Segment Distances |
无 |
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