cadence 总结资料

tian11223

第 1 章 焊盘制作 .........................................................................................................1
1.1 用 Pad Designer 制作焊盘 ...........................................................................................1
1.2 制作圆形热风焊盘.......................................................................................................6第 2 章 建立封装 .......................................................................................................10
2.1 新建封装文件.............................................................................................................10
2.2 设置库路径.................................................................................................................11
2.3 画元件封装.................................................................................................................12第 3 章 元器件布局 ...................................................................................................23
3.1 建立电路板(PCB) ......................................................................................................23
3.2 导入网络表.................................................................................................................24
3.3 摆放元器件.................................................................................................................26第 4 章 PCB 布线.......................................................................................................31
4.1 PCB 层叠结构 ............................................................................................................31
4.2 布线规则设置.............................................................................................................33
4.2.1 对象(object) ....................................................................................................35
4.2.2 建立差分对.....................................................................................................36
4.2.3 差分对规则设置.............................................................................................37
4.2.4 CPU 与 DDR 内存芯片走线约束规则..........................................................39
4.2.5 设置物理线宽和过孔.....................................................................................45
4.2.6 设置间距约束规则.........................................................................................52
4.2.7 设置相同网络间距规则.................................................................................55
4.3 布线.............................................................................................................................56
4.3.1 手工拉线.........................................................................................................56
4.3.2 应用区域规则.................................................................................................59
4.3.3 扇出布线.........................................................................................................60
4.3.4 差分布线.........................................................................................................62
4.3.5 等长绕线.........................................................................................................64
4.3.6 分割平面.........................................................................................................65第 5 章 输出底片文件 ...............................................................................................70
5.1 Artwork 参数设置 ......................................................................................................70
5.2 生成钻孔文件.............................................................................................................75
5.3 输出底片文件.............................................................................................................79 allegro_总结.pdf (1.98 MB, 下载次数: 0)

2015-10-25 14:24 上传

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