四位一体，UI Dream Machine开箱拆解
高性能双频802.11ac 4x4 Wave 2 AP；网管型4端口千兆交换机；具有IDS / IPS和DPI的高级安全网关；具有直观用户界面的UniFi网络控制器；可通过连接到局域网的其他UniFi设备进行扩展；内置1.7 GHz四核高性能处理器https://image.koolshare.cn/attachment/forum/202003/31/123818hzyyox3my6mo3x21.jpg
▲产品规格
开箱
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▲包装盒正面，UDM采用白色包装盒，显得更上档次
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▲包装盒背面，刻画了UDM的背部IO接口
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▲向上挪开盒盖，就能看到内部的UDM本体了
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▲从底盒中取出UDM，UDM外壳采用类肤质涂层，虽然质地摸起来很舒服，但是不耐脏
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▲底盒中存放有白色电源线一根
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▲插头为日标双孔，8字尾
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▲UDM正面一览。位于顶部有一圈LED灯带，通电后在出厂设置状态下亮白色，配置完成后亮蓝色
https://image.koolshare.cn/attachment/forum/202003/31/151053ua3yvediafznvy68.jpg
▲UDM背面一览。从上往下分别是四个千兆LAN口，一个千兆WAN口，一个电源插孔
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▲底部铭牌采用的是橡胶，正中央是Reset按键，周围一圈是用于冷空气进入的散热孔。UDM采用垂直风道散热
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▲顶盖上的U家Logo
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▲所有部件一览，全家福一张
拆解
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▲翘下UDM顶盖，可以看到位于顶部的金属阵列天线
https://image.koolshare.cn/attachment/forum/202003/31/151707aqyvxyt8qtrzx9yc.jpg
▲金属阵列天线下方是用于给LED导光的塑料灯罩
https://image.koolshare.cn/attachment/forum/202003/31/151842vtnmmh083mi33wbm.jpg
▲拆下金属屏蔽盖，可以看到最上层的PCB电路板，该PCB为无线芯片所在的电路板。可以看到周围的一圈LED灯珠，以及和金属阵列天线对接的四个IPX接口
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▲最上层的PCB电路板通过PCIe插口与底部PCB主电路板连接，拔掉最上层的无线PCB。需要注意的是，无线PCB背面有一个IPX接口，用于连接蓝牙天线
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▲取下无线PCB电路板，电路板上芯片部分用金属屏蔽盖做了屏蔽
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▲揭掉金属屏蔽盖
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▲内部芯片一览
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▲2.4G WLAN芯片采用的是MT7603EN，集成PA和LNA功放，来自联发科技。支持2x2 MIMO，最高支持300Mbps的连接速率。5G WLAN芯片采用的是MT7615N，集成PA和LNA功放，来自联发科技。支持4x4 MU-MIMO，支持160MHz频宽，最高支持1733Mbps的连接速率。蓝牙4.2芯片采用的是CSR8811，来自高通
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▲继续取下塑料固定环
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▲拆除位于UDM底部的四颗螺丝
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▲最后就可以将内部的PCB主电路板取出了
https://image.koolshare.cn/attachment/forum/202003/31/153841v077ltp9id0cw0tz.jpg
▲位于UDM内壁上的蓝牙天线
https://image.koolshare.cn/attachment/forum/202003/31/153918kedzniw0n3ifdgb0.jpg
▲UDM采用主动散热方式，侧面配备涡轮风扇和黑色导流罩
https://image.koolshare.cn/attachment/forum/202003/31/154051obhn8ochjoqdacso.jpg
▲另一侧则是用于给UDM供电的交转直电源模块
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▲拆下电源模块。线圈，变压器以及电容之间用704胶水做了固定
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▲去除喇叭模块。在UDM通电到启动完成，喇叭会有音乐提示
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▲卸下给芯片正面散热的金属装甲
https://image.koolshare.cn/attachment/forum/202003/31/154607k06xra10r0j6l6ii.jpg
▲再拆除给芯片背面散热的带主动散热的金属装甲
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▲带涡轮主动散热的金属装甲一览，冷空气被涡轮从底部吸入，沿着金属装甲，从顶端排出
https://image.koolshare.cn/attachment/forum/202003/31/155211m7v9uzz6b43nq2c6.jpg
▲PCB主电路板背面一览
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▲MX30UF4G18AB，FLASH芯片，来自MXIC，大小为512MB，用于存放UI的系统
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▲GL3224，USB 3.1 Gen1读卡器，为板载eMMC服务
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▲PCB主电路板正面一览，芯片部分被金属屏蔽盖覆盖
https://image.koolshare.cn/attachment/forum/202003/31/160405qugkfgtr2dxjrb2q.jpg
▲拆掉金属屏蔽盖后，PCB主电路板正面一览
https://image.koolshare.cn/attachment/forum/202003/31/160557rn3ffwdfw4nyqznm.jpg
▲CPU是Annapurna Labs AL324，4核心，Cortex-A57架构，主频1.7Ghz。内存是来自三星的K4A8G165WB-BCRC，DDR4 2400规格，单颗容量1GB，这里有两颗，共2GB
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▲ASM1042A，PCIe to 双端口USB3.0芯片。QCA8337，7端口千兆Switch芯片
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▲THGBMFG7C1LBAIL，eMMC芯片，容量为16GB，来自东芝。用于存放UI AC控制器软件
https://image.koolshare.cn/attachment/forum/202003/31/163618ahiw7vhj5558szwm.jpg
▲芯片简单示意图 谢谢分享！ 感谢楼主分享资源 ！！ 这个拆解很nb，像是专业的。
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