代码
| 相关对象
| 说明
|
单一字符代码
|
L
| Line
| 走线
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P
| Pin
| 元件脚
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V
| Via
| 贯穿孔
|
K
| Keep in/out
| 允许区域/禁止区域
|
C
| Component
| 元件层级
|
E
| Electrical Constraint
| 电气约束
|
J
| T-Junction
| 呈现T形的走线
|
I
| Island Form
| 被Pin或Via围成的负片孤铜
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错误代码前置码说明
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W
| Wire
| 与走线相关的错误
|
D
| Design
| 与整个电路板相关的错误
|
M
| Soldemask
| 与防焊层相关的错误
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错误代码后置码说明
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S
| Shape/Stub
| 与走线层的Shape或分支相关的错误
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N
| Not
Allowed
| 与不允许的设置相关的错误
|
W
| Width
| 与宽度相关的错误
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双字符错误代码
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BB
| Bondpad to Bondpad
| Bondpad之间的错误
|
BL
| Bondpad to Line
| Bondpad与Line之间的错误
|
BS
| Bondpad to Shape
| Bondpad与Shape 之间的错误
|
CC
| Package to Package
| Package之间的 Spacing 错误
|
Symbol Soldermask to Symbol
| Soldermask零件防焊层之间的Spacing 错误
|
DF
| Differential Pair Length Tolerance
| 差分对走线的长度误差过长
|
Differential Pair Primary Max Separation
| 差分对走线的主要距离太大
|
Differential Pair Secondary Max Separation
| 差分对走线的次要距离太大
|
Differential Pair Secondary Max Length
| 差分对走线的次要距离长度过长
|
DI
| Design Constraint Negative Plane Island
| 负片孤铜的错误
|
ED
| Propagation-Delay
| 走线的长度错误
|
Relative-Propagation-Delay
| 走线的等长错误
|
EL
| Max Exposed Length
| 走线在外层（TOP&BOTTOM）的长度过长
|
EP
| Max Net Parallelism Length-Distance Pair
| 已超过Net之间的平行长度
|
ES
| Max Stub Length
| 走线的分支过长
|
ET
| Electrical Topology
| 走线连接方式的错误
|
EV
| Max Via Count
| 已超过走线使用的VIA的最大数目
|
EX
| Max Crosstalk
| 已超过Crosstalk值
|
Max Peak Crosstalk
| 已超过Peak Crosstalk值
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HH
| Hold to Hold Spacing
| 钻孔之间的距离太近
|
HW
| Diagonal Wire to Hold Spacing
| 斜线与钻孔之间的距离太近
|
Hold to Orthogonal Wire Spacing
| 钻孔与垂直/水平线之间的距离太近
|
IM
| Impedance Constraint
| 走线的阻抗值错误
|
JN
| T Junction Not Allowed
| 走线呈T形的错误
|
KB
| Route Keepin
to Bondpad
| Bondpad在Keepin之外
|
Route keepout
to Bondpad
| Bondpad在keepout之内
|
Via Keepout
to
Bondpad
| Bondpad在Via Keepout之内
|
KC
| Package to Place Keepin Spacing
| 元件在Place Keepin之外
|
Package to Place Keepout Spacing
| 元件在Place Keepout之内
|
KL
| Line to Route Keepin Spacing
| 走线在Route Keepin之外
|
Line to Route Keepout Spacing
| 走线在Route Keepout之内
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KS
| Shape to Route Keepin Spacing
| Shape在Route Keepin之外
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Shape to Route Keepout Spacing
| Shape在Route Keepout之内
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KV
| BBVia to Route Keepin Spacing
| BBVia在Route Keepin之外
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BBVia to Route Keepout Spacing
| BBVia在Route Keepout之内
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BBVia to Via Keepout Spacing
| BBVia在Via Keepout之内
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Test Via to Route Keepin Spacing
| Test Via在Route Keepin之外
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Test Via to Route Keepout Spacing
| Test Via在Route Keepout之内
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Test Via to Via Keepout Spacing
| Test Via在Via Keepout之内
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Through Via to Route Keepin Spacing
| Through Via在Route Keepin之外
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Through Via to Route Keepout Spacing
| Through Via在Route Keepout之内
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Through Via to Via Keepout Spacing
| Through Via在Via Keepout之内
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LB
| Min Self Crossing Loopback Length
| 无
|
LL
| Line to Line Spacing
| 走线之间太近
|
LS
| Line to Shape Spacing
| 走线与Shape 太近
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LW
| Min Line Width
| 走线的宽度太细
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Min Neck Width
| 走线变细的宽度太细
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MA
|
Soldermask Alignment Error Pad
| Soldermask Tolerance太小
|
MC
| Pin/Via Soldermask to Symbol Soldermask
| Pad与Symbol Soldermask之间的错误
|
MM
| Pin/Via Soldermask to Pin/Via Soldermask
| Pad
Soldermask之间的错误
|
PB
| Pin to Bondpad
| Pin与Bondpad之间的错误
|
PL
| Line to SMD Pin Spacing
| 走线与SMD元件脚太近
|
Line to Test Pin Spacing
| 走线与Test元件脚太近
|
Line to Through Pin Spacing
| 走线与Through元件脚太近
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PP
| SMD Pin to SMD Pin Spacing
| SMD元件脚与SMD元件脚太近
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SMD Pin to Test Pin Spacing
| SMD元件脚与Test元件脚太近
|
Test Pin to Test Pin Spacing
| Test元件脚与Test元件脚太近
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Test Pin to Through Pin Spacing
| Test元件脚与Through元件脚太近
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Through Pin to SMD Pin Spacing
| Through元件脚与SMD元件脚太近
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Through Pin to Through Pin Spacing
| Through元件脚与Through元件脚太近
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PS
| Shape to SMD Pin Spacing
| Shape与SMD元件脚太近
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Shape to Test Pin Spacing
| Shape与Test元件脚太近
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Through Pin to Shape Spacing
| Through元件脚与Shape太近
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PV
| BBVia to SMD Pin Spacing
| BBVia与SMD元件脚太近
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BBVia to Test Pin Spacing
| BBVia与Test元件脚太近
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BBVia to Through Pin Spacing
| BBVia 与Through元件脚太近
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SMD Pin to Test Via Spacing
| SMD Pin与Test Via太近
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SMD Pin to Through Via Spacing
| SMD Pin与Through Via太近
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Test Pin to Test Via Spacing
| Test Pin与Test Via太近
|
Test Pin to Through Via Spacing
| Test Pin与Through Via太近
|
Test Via to Through Pin Spacing
| Test Via与Through Pin太近
|
Through Pin to Through Via Spacing
| Through Pin与Through Via太近
|
RC
| Package to Hard Room
| 元件在其他的Room之内
|
RE
| Min Length Route End Segment at 135Degree
| 无
|
Min Length Route End Segment at 45/90Degree
| 无
|
SB
| 135Degree Turn to Adjacent Crossing Distance
| 无
|
90Degree Turn to Adjacent Crossing Distance
| 无
|
SL
| Min Length Wire Segment
| 无
|
Min Length Single Segment Wire
| 无
|
SN
| Allow on Etch Subclass
| 允许在走线层上
|
SO
| Segment Orientaion
| 无
|
BB
| Bondpad to Bondpad
| Bondpad之间的错误
|
SS
| Shape to Shape
| Shape之间的错误
|
TA
| Max Turn Angle
| 无
|
VB
| Via to Bondpad
| Via 与Bondpad之间的错误
|
VG
| Max BB Via Stagger Distance
| 同一段线的BB Via之间的距离太长
|
Min BB Via Gap
| BB Via之间太近
|
Min BB Via Stagger Distance
| 同一段线的BB Via之间的距离太近
|
Pad/Pad Direct Connect
| Pad 在另一个Pad 之上
|
VL
| BB Via to Line Spacing
| BB Via与走线太近
|
Line to Through Via Spacing
| 走线与Through Via太近
|
Line to Test Via Spacing
| 走线与Test Via太近
|
VS
| BB Via to Shape Spacing
| BB Via与Shape太近
|
Shape to Test Via Spacing
| Shape 与Test Via太近
|
Shape to Through Via Spacing
| Shape与Through Via太近
|
VV
| BB Via to BB Via
Spacing
| BB Via之间太近
|
BB Via to Test Via Spacing
| BB Via与Test Via太近
|
BB Via to Through Via Spacing
| BB Via与Through Via太近
|
Test Via to Test Via Spacing
| Test Via之间太近
|
Test Via to Through Via Spacing
| Test Via与Through Via太近
|
Through Via to Through Via Spacing
| Through Via之间太近
|
WA
| Min Bonding Wire Length
| Bonding Wire 长度太短
|
WE
| Min End Segment Length
| 无
|
Min Length Wire End Segment at 135Degree
| 无
|
Min Length Wire End Segment at 45/90Degree
| 无
|
WI
| Max Bonding Wire Length
| Bonding Wire 长度太长
|
WW
| Diagonal Wire to Diagonal Wire Spacing
| 斜线之间太近
|
Diagonal Wire to Orthogonal Wire Spacing
| 斜线与垂直/水平线之间的距离太近
|
Orthogonal Wire to Orthogonal Wire Spacing
| 垂直/水平线之间的距离太近
|
WX
| Max Number of Crossing
| 无
|
Min Distance between Crossing
| 无
|
XB
| 135 Degree Turn to Adjacent Crossing Distance
| 无
|
90 Degree Turn to Adjacent Crossing Distance
| 无
|
XD
| Externally Determined Violation
| 无
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XS
| Crossing to Adjacent Segment Distances
| 无
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发表于 2012-3-29 10:49:10
