如果PCB的层数超过4层,PCB的走线从其中的某两层走线(除从表层到表层外),总会产生类似于下图这种情形的stub:产生多余的镀铜部分,当电路信号的频率增加到一定高度后,多余的镀铜就相当于天线一样,产生信号辐射对周围的其他信号造成干扰,严重时将影响到线路系统的正常工作,Backdrill的作用就是将多余的镀铜用钻孔的方式钻掉,从而消除此类EMI问题。其操作步骤和注意事项如下:
<IMG alt=给net设定Backdrill src="http://pagesadmin.ednchina.com/images/article/0427846e-8d62-4c99-8081-c35c88091f98/1.jpg" _max_pth_stub属性>
1.给net设定Backdrill_max_pth_stub属性
Property BACKDRILL_MAX_PTH_STUB
Purpose Identificationofnetstargetedforbackdrilling
Usage Required
Value Maxallowablestubinlength(databaseunits)
Objects Nets
Backdrillanalysisflag S
2.给net设定Backdrill_min_pin_pth属性,Backdrill_min_pin_pth考虑可靠性,必须保证BACKDRILL去掉多余镀铜后,保证一定剩余一定长度.
<IMG alt=给net设定Backdrill src="http://pagesadmin.ednchina.com/images/article/0427846e-8d62-4c99-8081-c35c88091f98/2.jpg" _min_pin_pth属性>
Property BACKDRILL_MIN_PIN_PTH
Purpose Ensuresminimumpinplatingdepthisnotcompromised
Usage Optional
Value Length
Objects Symbols,pins
Backdrillanalysisflag P
3.压接的接插件backdrill:要保证良好的接触,必须保证下面的值:
Property BACKDRILL_PRESSFIT_CONNECTOR
Purpose Use on pressfit connectors to permit backdrilling from both sides of the board. Backdrill depth will not protrude into contact range as defined by the property string. .
Usage Optional
Value <value1:value2>wherevalues=pincontactrange;thisvaluemustbeobtainedfromthemanufacturer
Objects Symbols
Backdrillanalysisflag n/a
4.有些场合不能用此功能的可以用下面的命令排除.
Exclusions It may be necessary to exclude certain objects from backdrilling even though stub violations are present. The BACKDRILL_EXCLUDE property can be applied to symbols, pins or vias at both the library and design level using Edit - Property. Common examples might include solder tail connectors or a dense pin escape pattern in BGA areas. The PCB designer should consult with a manufacturing engineer before assuming all pin/via objects are suitable for backdrilling.
Property BACKDRILL_EXCLUDE
Purpose Excludesobjectsfrombackdrillingeventhoughstubmaybepresent
Usage Optional
Value Boolean(true/false)
Objects Symbols,pins,vias
Backdrillanalysisflag X
背钻与否,不仅取决于数据速率还取决于板厚,下面简单的公式
: B# ?: O. `! u. L: P o2 e/ P板厚(mil)<300/数据速率,不需要背钻;
9 g, T$ n0 L0 k" V, l& Z6 q300/数据速率<板厚(mil)<600/数据速率,根据具体情况决定是否背钻;
, r; a! {3 k8 U5 | b- l0 L板厚(mil)>600/数据速率,必须背钻。
补充一下,backdrill工艺已经比较成熟,成品率也能够达到要求,只是采用backdrill会增加10%~20%的成本 |