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[技术文章] 希荻微电子发布智能高功率多模无线充电芯片

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    发表于 2017-10-31 14:09:41 | 显示全部楼层 |阅读模式

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    作为无线充电WPC和Air_Fuel(磁感应和磁共振技术) 两大标准的正式会员,希荻微电子最新推出的集成三模大功率无线充电接收芯片HL6101,实现了对WPC和Air_Fuel模式的全面兼容和自动识别,并且支持最高15W输出功率。
    希荻微电子作为一家高性能电源管理芯片的初创公司,正在与美国高通技术公司深入合作,其开发的三模无线充电芯片将会在后续的高通骁龙™移动平台上投入使用。作为无线充电WPC和Air_Fuel(磁感应和磁共振技术) 两大标准的正式会员,希荻微电子最新推出的集成三模大功率无线充电接收芯片HL6101,实现了对WPC和Air_Fuel模式的全面兼容和自动识别,并且支持最高15W输出功率。
    希荻微HL6101作为一款全集成无线充电接收芯片,全面兼容与自动识别WPC V1.2(Qi) 和 Air_Fuel标准。该芯片不仅集成了高效率的全同步整流器和高性能的开关稳压器,而且支持4-12V 输出电压和最高15W输出功率,提供了业界最佳的转换效率。
    HL6101作为一款高度集成的无线充电接收芯片,优化精简了很多外围器件,能轻松内嵌到智能手机的主板中,具有很高的设计灵活性;同时能够匹配不同的线圈设计和调整输出电压以适应不同输入电压规格的锂电池管理充电芯片。该款芯片在侦测接收模式下,通过优化全同步整流器工作条件来达到最优的效率,其中较为突出特性是采用高效率的开关稳压器代替传统的低压差稳压器(LDO)提升充电效率,使得芯片可以接受较宽的Vrect电压输入,同时具有较宽的Vout输出电压,并且能保持极高的功率转换效率。
    HL6101集成多模式无线充电接收解决方案全面兼容WPC(Qi)和Air_Fuel,同时集成了多重保护,针对输入过压、输出过载、过温等异常情况,保证在所有应用场合下的安全运行,这将为用户带来最佳体验。
    HL6101分别有WLCSP和QFN两种封装形式,WLCSP封装采用64-bump,0.4mm间距,QFN封装采用32-pin 5mmx5mm 。该芯片可支持各种1-2节锂电池无线充电应用,运用非常广泛,可运用于智能手机、平板电脑、笔记本电脑以及充电宝和其他配件等领域。
    希荻微电子是一家领先的模拟集成电路设计公司,其生产的快充、电量计量和高效功率转换的芯片产品是移动设备、配件和其他电池应用的核心组成部分。欢迎通过访问我们官网http://www.halomicro.com来更多地了解希荻微电子。
    备注:高通和骁龙是高通公司在美国和其他国家注册的商标,高通骁龙是高通技术公司的产品。
    另附英文版:


    Halo Microelectronics Releases Smart High-Power Multi-Mode Wireless Charger

    HALO Microelectronics, a leading fast battery charger IC start-up, today announces the release of its fully integrated tri-mode high-power wireless charging receiver IC. This new product, HL6101, enables up-to-15W of wireless charging capability and automatic detection and adaption to all common wireless-charging standards: AirFuel Alliance (resonant and inductive) and WPC. Halo Microelectronics is working with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to develop a tri-mode wireless charging IC for future Qualcomm Snapdragon™ Mobile Platforms.

                                   
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    HL6101 is a fully integrated single-chip wireless charging power receiver IC that automatically detects and self-configures to work with WPC V1.2(Qi) and Air Fuel (resonant and inductive) standards. It integrates a high-efficiency full-synchronous rectifier and a high-performance switching regulator to deliver a maximum of 15W and 4-12V programmable output voltage. It offers with best-in-class conversion efficiency, minimum PCB footprint, as well as maximum design flexibility between receiving coil design and output voltage regulation to match down-stream Li-Ion battery charge ICs. This IC maximize charging efficiency by optimizing the full-synchronous rectifier’s operating condition based on the detected receiving mode, and adopting a high-efficiency switching post-regulator instead of the conventional low drop-out regulator (LDO). This configuration maintains high power conversion efficiency over a wide range of Vrect and Vout combination.
    This IC enables multi-mode wireless charging receiver solution that works with both inductive and resonant transmitters to offer a transparent user experience. It also integrates comprehensive protection against input over-voltage, output over-load, over temperature and other abnormal conditions to guarantee safe operation under all application usage scenarios. HL6101 is available in a 64-bump, 0.4mm pitch, Wafer-Level Chip-Scale package (WLCSP), or a 32-pin 5mmx5mm QFN package.
    HL6101 is suitable for a variety of wireless charging applications with 1-2s Li-Ion Battery. This includes mobile devices like smart phones, tablets and laptops, power banks and other accessories.


    About Halo Microelectronics

    Halo Microelectronics, Inc. is a leading fabless IC design company for fast battery charging, fuel gauging and high-efficiency power conversion. The company’s products are key building blocks for mobile devices, accessories and other battery powered applications. For more information please visit http://www.halomicro.com.
    *Notes:Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc. *
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