24LC04BT_EEPROM

hytech

 2007-2019 Microchip Technology Inc. DS20001708M-page 124AA04/24LC04B/24FC04Device Selection TableFeatures• Single Supply with Operation down to 1.7V for24AA04 and 24FC04 Devices, 2.5V for 24LC04BDevices• Low-Power CMOS Technology:- Read current 1 mA, maximum- Standby current 1 μA, maximum (I-temp.)• 2-Wire Serial Interface, I2C Compatible• Schmitt Trigger Inputs for Noise Suppression• Output Slope Control to Eliminate Ground Bounce• 100 kHz, 400 kHz and 1 MHz Compatibility• Page Write Time: 5 ms, Maximum• Self-Timed Erase/Write Cycle• 16-Byte Page Write Buffer• Hardware Write-Protect• ESD Protection >4,000V• More than 1 Million Erase/Write Cycles• Data Retention >200 Years• Factory Programming Available• RoHS Compliant• Temperature Ranges:- Industrial (I): -40°C to +85°C- Extended (E): -40°C to +125°C• Automotive AEC-Q100 QualifiedPackages• 8-Lead DFN, 8-Lead MSOP, 8-Lead PDIP,8-Lead SOIC, 8-Lead TDFN, 8-Lead TSSOP,8-Lead UDFN, 5-Lead SOT-23 and 4-Ball CSPDescriptionThe Microchip Technology Inc. 24XX04(1)is a 4-KbitElectrically Erasable PROM. The device is organizedas two blocks of 256 x 8-bit memory with a 2-wire serialinterface. Its low-voltage design permits operationdown to 1.7V with standby and active currents of only1 μA and 1 mA, respectively. The 24XX04 also has apage write capability for up to 16 bytes of data.Package TypesPart Number VCC Range Max. Clock Frequency Temp. Ranges Available Packages24AA04 1.7V-5.5V 400 kHz(1) I MC, MNY, P, MS, SN, ST, OT, CSP24LC04B 2.5V-5.5V 400 kHz I, E MC, MNY, P, MS, SN, ST, OT24FC04 1.7V-5.5V 1 MHz I, E MUY, P, MS, SN, ST, OTNote 1: 100 kHz for VCC < 2.5V.Note 1: 24XX04 is used in this document as ageneric part number for the24AA04/24LC04B/24FC04 devices.123487658-Lead DFN/TDFN/UDFN 8-Lead SOIC/TSSOPA0A1A2VSSWPSCLSDAVCC5-Lead SOT-23Note 1: Pins A0, A1 and A2 are not used by the 24XX04 (no internal connections).(Top View) (Top View)12348765(Top View)8-Lead PDIP/MSOP(Top View)4-Ball CSP(Top View)VCC 1 VSSSCL SDAA0A1A2VSSWPSCLSDA1 VCC2348765A0A1A2VSSWPSCLSDA1 VCC234876512354SCLVSSSDA VCCWP23 4(1)(1)(1)(1)(1)(1)(1)(1)(1)4K I2C Serial EEPROM 2007-2019 Microchip Technology Inc. DS20001708M-page 224AA04/24LC04B/24FC04Block DiagramHV GeneratorEEPROMArrayPage LatchesYDECXDECSense Amp.MemoryControlLogicI/OControlLogicI/OWPSDASCLVCCVSSR/W Control 2007-2019 Microchip Technology Inc. DS20001708M-page 324AA04/24LC04B/24FC041.0 ELECTRICAL CHARACTERISTICSAbsolute Maximum Ratings (†)VCC.............................................................................................................................................................................6.5VAll inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0VStorage temperature ...............................................................................................................................-65°C to +150°CAmbient temperature with power applied................................................................................................-40°C to +125°CESD protection on all pins  4 kVTABLE 1-1: DC CHARACTERISTICS† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to thedevice. This is a stress rating only and functional operation of the device at those or any other conditions above thoseindicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions forextended periods may affect device reliability.DC CHARACTERISTICSIndustrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5VExtended (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V (24LC04B)Extended (E): TA = -40°C to +125°C, VCC = +1.7V to +5.5V (24FC04)Param.No. Symbol Characteristic Min. Typ. Max. Units ConditionsD1 VIH High-Level Input Voltage 0.7 VCC ——VD2 VIL Low-Level Input Voltage — — 0.3 VCC VD3 VHYS Hysteresis of SchmittTrigger Inputs0.05 VCC ——V NoteD4 VOL Low-Level OutputVoltage— — 0.40 V IOL = 3.0 mA, VCC = 2.5VD5 ILI Input Leakage Current — — ±1 μA VIN = VSS or VCCD6 ILO Output Leakage Current — — ±1 μA VOUT = VSS or VCCD7 CIN,COUTPin Capacitance(all inputs/outputs)— — 10 pF VCC = 5.0V (Note)TA = 25°C, FCLK = 1 MHzD8 ICCWRITE Operating Current — — 3 mA VCC = 5.5V, SCL = 400 kHzD9 ICCREAD — — 1 mA VCC = 5.5V, SCL = 400 kHzD10 ICCS Standby Current — — 1 μA SDA = SCL = VCCWP = VSS, I-Temp.——3 μA SDA = SCL = VCCWP = VSS, E-Temp. (24FC04)——5 μA SDA = SCL = VCCWP = VSS, E-Temp. (24LC04B)Note: This parameter is periodically sampled and not 100% tested. 2007-2019 Microchip Technology Inc. DS20001708M-page 424AA04/24LC04B/24FC04TABLE 1-2: AC CHARACTERISTICSAC CHARACTERISTICSIndustrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5VExtended (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V (24LC04B)Extended (E): TA = -40°C to +125°C, VCC = +1.7V to +5.5V (24FC04)Param.No. Symbol Characteristic Min. Typ. Max. Units Conditions1 FCLK Clock Frequency — — 400 kHz 2.5V ≤ VCC ≤ 5.5V— — 100 kHz 1.7V ≤ VCC < 2.5V (24AA04)— — 1000 kHz 1.7V ≤ VCC ≤ 5.5V (24FC04)2 THIGH Clock High Time 600 — — ns 2.5V ≤ VCC ≤ 5.5V4000 — — ns 1.7V ≤ VCC < 2.5V (24AA04)260 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC04)3 TLOW Clock Low Time 1300 — — ns 2.5V ≤ VCC ≤ 5.5V4700 — — ns 1.7V ≤ VCC < 2.5V (24AA04)500 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC04)4 TR SDA and SCL Rise Time — — 300 ns 2.5V ≤ VCC ≤ 5.5V (Note 1)— — 1000 ns 1.7V ≤ VCC < 2.5V (24AA04)(Note 1)— — 1000 ns 1.7V ≤ VCC ≤ 5.5V (24FC04)(Note 1)5 TF SDA and SCL Fall Time — — 300 ns Note 16 THD:STA Start Condition HoldTime600 — — ns 2.5V ≤ VCC ≤ 5.5V4000 — — ns 1.7V ≤ VCC < 2.5V (24AA04)250 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC04)7 TSU:STA Start Condition SetupTime600 — — ns 2.5V ≤ VCC ≤ 5.5V4700 — — ns 1.7V ≤ VCC < 2.5V (24AA04)250 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC04)8 THDAT Data Input Hold Time 0 — — ns Note 29 TSUAT Data Input Setup Time 100 — — ns 2.5V ≤ VCC ≤ 5.5V250 — — ns 1.7V ≤ VCC < 2.5V (24AA04)50 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC04)10 TSU:STO Stop Condition SetupTime600 — — ns 2.5V ≤ VCC ≤ 5.5V4000 — — ns 1.7V ≤ VCC < 2.5V (24AA04)250 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC04)11 TSU:WP WP Setup Time 600 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC04)12 THD:WP WP Hold Time 600 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC04)13 TAA Output Valid from Clock — — 900 ns 2.5V ≤ VCC ≤ 5.5V (Note 2)— — 3500 ns 1.7V ≤ VCC < 2.5V (24AA04)(Note 2)— — 450 ns 1.7V ≤ VCC ≤ 5.5V (24FC04)(Note 2)Note 1: Characterized but not 100% tested.2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.3: CB = total capacitance of one bus line in pF.4: This parameter is not tested but ensured by characterization. For endurance estimates in a specificapplication, please consult the Total Endurance™ Model which can be obtained from Microchip’s website atwww.microchip.com. 2007-2019 Microchip Technology Inc. DS20001708M-page 524AA04/24LC04B/24FC04FIGURE 1-1: BUS TIMING DATA14 TBUF Bus Free Time: The timethe bus must be freebefore a new transmission can start1300 — — ns 2.5V ≤ VCC ≤ 5.5V4700 — — ns 1.7V ≤ VCC < 2.5V (24AA04)500 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC04)15 TOF Output Fall Time from VIHMinimum to VIL Maximum20+0.1CB — 250 ns 2.5V ≤ VCC ≤ 5.5V (24LC04B)(Notes 1, 2 and 3)— — 250 ns 1.7V ≤ VCC < 2.5V (24AA04)(Notes 1 and 2)16 TSP Input Filter SpikeSuppression(SDA and SCL pins)— — 50 ns Note 117 TWC Write Cycle Time(byte or page)— — 5 ms18 Endurance 1,000,000 — — cycles 25°C, 5.5V, Page Mode(Note 4)Note 1: Characterized but not 100% tested.2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.3: CB = total capacitance of one bus line in pF.4: This parameter is not tested but ensured by characterization. For endurance estimates in a specificapplication, please consult the Total Endurance™ Model which can be obtained from Microchip’s website atwww.microchip.com.AC CHARACTERISTICS (Continued)Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5VExtended (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V (24LC04B)Extended (E): TA = -40°C to +125°C, VCC = +1.7V to +5.5V (24FC04)Param.No. Symbol Characteristic Min. Typ. Max. Units Conditions(unprotected)(protected)SCLSDAINSDAOUTWP57616328 913D3 41011 1214 2007-2019 Microchip Technology Inc. DS20001708M-page 624AA04/24LC04B/24FC042.0 PIN DESCRIPTIONSThe descriptions of the pins are listed in Table 2-1.TABLE 2-1: PIN FUNCTION TABLE2.1 A0, A1, A2The A0, A1 and A2 pins are not used by the 24XX04.They may be left floating or tied to either VSS or VCC.2.2 Serial Address/Data Input/Output(SDA)The SDA input is a bidirectional pin used to transferaddresses and data into and out of the device. Sinceit is an open-drain terminal, the SDA bus requires apull-up resistor to VCC (typical 10 kΩ for 100 kHz,2 kΩ for 400 kHz and 1 MHz).For normal data transfer, SDA is allowed to changeonly during SCL low. Changes during SCL high arereserved for indicating Start and Stop conditions.2.3 Serial Clock (SCL)The SCL input is used to synchronize the data transferto and from the device.2.4 Write-Protect (WP)This pin must be connected to either VSS or VCC.If tied to VSS, normal memory operation is enabled(read/write the entire memory 000-1FF).If tied to VCC, write operations are inhibited. The entirememory will be write-protected. Read operations arenot affected.The Chip Scale package does not support thewrite-protect feature.Name DFN MSOP PDIP SOIC TDFN(1) TSSOP UDFN(1) SOT-23 CSP DescriptionA0 1 1 1 1 1 1 1 — — Not ConnectedA1 2 2 2 2 2 2 2 — — Not ConnectedA2 3 3 3 3 3 3 3 — — Not ConnectedVSS 4 4 4 4 4 4 4 2 2 GroundSDA 5 5 5 5 5 5 5 3 4 Serial Address/Data I/OSCL 6 6 6 6 6 6 6 1 3 Serial ClockWP 7 7 7 7 7 7 7 5 — Write-Protect InputVCC 8 8 8 8 8 8 8 4 1 Power SupplyNote 1: The exposed pad on the TDFN/UDFN package can be connected to VSS or left floating. 2007-2019 Microchip Technology Inc. DS20001708M-page 724AA04/24LC04B/24FC043.0 FUNCTIONAL DESCRIPTIONThe 24XX04 supports a bidirectional, 2-wire bus anddata transmission protocol. A device that sends dataonto the bus is defined as transmitter, while defining adevice receiving data as a receiver. The bus has to becontrolled by a master device which generates theSerial Clock (SCL), controls the bus access andgenerates the Start and Stop conditions, while the24XX04 works as slave. Both master and slave canoperate as transmitter or receiver, but the masterdevice determines which mode is activated.4.0 BUS CHARACTERISTICSThe following bus protocol has been defined:• Data transfer may be initiated only when the busis not busy.• During data transfer, the data line must remainstable whenever the clock line is high. Changes inthe data line while the clock line is high will beinterpreted as a Start or Stop condition.Accordingly, the following bus conditions have beendefined (Figure 4-1).4.1 Bus Not Busy (A)Both data and clock lines remain high.4.2 Start Data Transfer (B)A high-to-low transition of the SDA line while the clock(SCL) is high determines a Start condition. Allcommands must be preceded by a Start condition.4.3 Stop Data Transfer (C)A low-to-high transition of the SDA line while the clock(SCL) is high determines a Stop condition. Alloperations must be ended with a Stop condition.4.4 Data Valid (D)The state of the data line represents valid data when,after a Start condition, the data line is stable for theduration of the high period of the clock signal.The data on the line must be changed during the lowperiod of the clock signal. There is one clock pulse perbit of data.Each data transfer is initiated with a Start condition andterminated with a Stop condition. The number of databytes transferred between the Start and Stopconditions is determined by the master device and is,theoretically, unlimited (although only the last sixteenwill be stored when doing a write operation). When anoverwrite does occur, it will replace data based on thefirst-in first-out (FIFO) principle.4.5 AcknowledgeEach receiving device, when addressed, is obliged togenerate an acknowledge after the reception of eachbyte. The master device must generate an extra clockpulse which is associated with this Acknowledge bit.The device that acknowledges has to pull down theSDA line during the acknowledge clock pulse in such away that the SDA line is stable-low during the highperiod of the acknowledge-related clock pulse.Moreover, setup and hold times must be taken intoaccount. During reads, a master must signal an end ofdata to the slave by not generating an Acknowledge biton the last byte that has been clocked out of the slave.In this case, the slave (24XX04) will leave the data linehigh to enable the master to generate the Stopcondition.FIGURE 4-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUSNote: The 24XX04 does not generate anyAcknowledge bits if an internalprogramming cycle is in progress.SCLSDA(A) (B) (D) (D) (A) (C)StartConditionAddress orAcknowledgeValidDataAllowedto ChangeStopCondition 2007-2019 Microchip Technology Inc. DS20001708M-page 824AA04/24LC04B/24FC045.0 DEVICE ADDRESSINGA control byte is the first byte received following theStart condition from the master device. The control byteconsists of a four-bit control code. For the 24XX04, thisis set as ‘1010’ binary for read and write operations.The next two bits of the control byte are “don’t cares” forthe 24XX04. The last bit, B0, is used by the masterdevice to select which of the two 256-word blocks ofmemory are to be accessed. This bit is, in effect, theMost Significant bit of the word address. The combination of the 4-bit control code and the next three bits arecalled the slave address.The last bit of the control byte is the Read/Write (R/W)bit and it defines the operation to be performed. Whenset to ‘1’, a read operation is selected. When set to ‘0’,a write operation is selected. Following the Startcondition, the 24XX04 monitors the SDA bus, checkingthe device type identifier being transmitted. Uponreceiving a valid slave address and the R/W bit, theslave device outputs an Acknowledge signal on theSDA line. Depending on the state of the R/W bit, the24XX04 will select a read or write operation.The next byte received defines the address of the firstdata byte within the selected block (Figure 5-2). Theword address byte uses all eight bits.FIGURE 5-1: CONTROL BYTEALLOCATIONFIGURE 5-2: ADDRESS SEQUENCE BIT ASSIGNMENTSOperation ControlCode Block Select R/WRead 1010 Block Address 1Write 1010 Block Address 010 10 x x B0 R/W ACKStart BitRead/Write Bitx = “don’t care”SSlave AddressAcknowledge BitControl CodeBlockSelectBits1010 x x R/W •••••Control Byte Word Address ByteControlCodeBlockSelectBitsx = “don’t care”B0 A7 • A0 2007-2019 Microchip Technology Inc. DS20001708M-page 924AA04/24LC04B/24FC046.0 WRITE OPERATION6.1 Byte WriteFollowing the Start condition from the master, thedevice code (4 bits), the block address (2 bits, “don’tcare”, plus B0 bit) and the R/W bit, which is a logic-low,is placed onto the bus by the master transmitter. Thisindicates to the addressed slave receiver that a bytewith a word address will follow after it has generated anAcknowledge bit during the ninth clock cycle.Therefore, the next byte transmitted by the master isthe word address and will be written into the AddressPointer of the 24XX04. After receiving anotherAcknowledge signal from the 24XX04, the masterdevice will transmit the data word to be written into theaddressed memory location. The 24XX04acknowledges again and the master generates a Stopcondition. This initiates the internal write cycle, and,during this time, the 24XX04 will not generateAcknowledge signals (Figure 6-1).6.2 Page WriteThe write control byte, word address and first data byteare transmitted to the 24XX04 in the same way as in abyte write. However, instead of generating a Stopcondition, the master transmits up to 16 data bytes tothe 24XX04, which are temporarily stored in theon-chip page buffer and will be written into the memoryonce the master has transmitted a Stop condition.Upon receipt of each word, the four lower-orderAddress Pointer bits, which form the byte counter, areinternally incremented by one. The higher-orderfour bits of the word address and bit B0 remainconstant. If the master should transmit more than 16words prior to generating the Stop condition, theAddress Pointer will roll over and the previouslyreceived data will be overwritten. As with the byte writeoperation, once the Stop condition is received, aninternal write cycle will begin (Figure 6-2).6.3 Write ProtectionThe WP pin allows the user to write-protect the entirearray (000-1FF) when the pin is tied to VCC. If tied toVSS, the write protection is disabled. The Chip Scalepackage does not support the hardware WP mode.FIGURE 6-1: BYTE WRITENote: Page write operations are limited to writing bytes within a single physical pageregardless of the number of bytesactually being written. Physical pageboundaries start at addresses that areinteger multiples of the page buffer size(or ‘page size’) and end at addresses thatare integer multiples of page size – 1. If apage write command attempts to writeacross a physical page boundary, theresult is that the data wraps around to thebeginning of the current page (overwritingdata previously stored there), instead ofbeing written to the next page, as might beexpected. It is therefore necessary for theapplication software to prevent page writeoperations that would attempt to cross apage boundary.S PBus ActivityMasterSDA LineBus ActivitySTARTSTOPControlByteWordAddress DataACKACKACK1 0 1 0 x x B0 0x = “don’t care”BlockSelectBits 2007-2019 Microchip Technology Inc. DS20001708M-page 1024AA04/24LC04B/24FC04FIGURE 6-2: PAGE WRITES PBus ActivityMasterSDA LineBus ActivitySTARTControlByteWordAddress (n) Data (n) Data (n + 15)STOPACKACKACKACKACKData (n + 1)x = “don’t care”10 10 x x 0BlockSelectBitsB0 2007-2019 Microchip Technology Inc. DS20001708M-page 1124AA04/24LC04B/24FC047.0 ACKNOWLEDGE POLLINGSince the device will not acknowledge during a writecycle, this can be used to determine when the cycle iscomplete (this feature can be used to maximize busthroughput). Once the Stop condition for a writecommand has been issued from the master, the deviceinitiates the internally-timed write cycle. ACK pollingcan then be initiated immediately. This involves themaster sending a Start condition followed by the controlbyte for a write command (R/W = 0). If the device is stillbusy with the write cycle, no ACK will be returned. If thecycle is complete, the device will return the ACK andthe master can then proceed with the next read or writeoperation. See Figure 7-1 for a flow diagram of thisoperation.FIGURE 7-1: ACKNOWLEDGEPOLLING FLOWSendWrite CommandSend StopCondition toInitiate Write CycleSend StartSend Control Bytewith R/W = 0Did DeviceAcknowledge(ACK = 0)?NextOperationNoYes 2007-2019 Microchip Technology Inc. DS20001708M-page 1224AA04/24LC04B/24FC048.0 READ OPERATIONRead operations are initiated in the same way as writeoperations, with the exception that the R/W bit of theslave address is set to ‘1’. There are three basic typesof read operations: current address read, random readand sequential read.8.1 Current Address ReadThe 24XX04 contains an Address Pointer thatmaintains the address of the last word accessed,internally incremented by one. Therefore, if the previous access (either a read or write operation) was toaddress n, the next current address read operationwould access data from address n + 1. Upon receipt ofthe slave address with R/W bit set to ‘1’, the 24XX04issues an acknowledge and transmits the 8-bit dataword. The master will not acknowledge the transfer, butdoes generate a Stop condition and the 24XX04discontinues transmission (Figure 8-1).8.2 Random ReadRandom read operations allow the master to accessany memory location in a random manner. To performthis type of read operation, the word address must firstbe set. This is accomplished by sending the wordaddress to the 24XX04 as part of a write operation.Once the word address is sent, the master generates aStart condition following the acknowledge. Thisterminates the write operation, but not before the internal Address Pointer is set. The master then issues thecontrol byte again, but with the R/W bit set to a ‘1’. The24XX04 will then issue an acknowledge and transmitsthe 8-bit data word. The master will not acknowledgethe transfer, but does generate a Stop condition and the24XX04 discontinues transmission (Figure 8-2).8.3 Sequential ReadSequential reads are initiated in the same way as arandom read, except that once the 24XX04 transmitsthe first data byte, the master issues an acknowledge(as opposed to a Stop condition in a random read). Thisdirects the 24XX04 to transmit the next sequentiallyaddressed 8-bit word (Figure 8-3).To provide sequential reads the 24XX04 contains aninternal Address Pointer which is incremented by oneat the completion of each operation. This AddressPointer allows the entire memory contents to be seriallyread during one operation.8.4 Noise ProtectionThe SCL and SDA inputs have Schmitt Trigger andfilter circuits which suppress noise spikes to assureproper device operation even on a noisy bus.FIGURE 8-1: CURRENT ADDRESS READS PBus ActivityMasterSDA LineBus ActivitySTOPControlByte Data (n)ACKNoACKSTARTBlockSelect x = “don’t care” Bits1010 x x B0 1 2007-2019 Microchip Technology Inc. DS20001708M-page 1324AA04/24LC04B/24FC04FIGURE 8-2: RANDOM READFIGURE 8-3: SEQUENTIAL READS S PBus ActivityMasterSDA LineBus ActivitySTARTSTOPControlByteACKWordAddress (n)ControlByteSTARTData (n)ACKACKNoACx = “don’t care” K1010 x x 0 1010 x x 1BlockSelectBitsBlockSelectBitsB0 B0PBus ActivityMasterSDA LineBus ActivitySTOPControlByteACKNoACKData (n) Data (n + 1) Data (n + 2) Data (n + x)ACKACKACK1 2007-2019 Microchip Technology Inc. DS20001708M-page 1424AA04/24LC04B/24FC049.0 PACKAGING INFORMATION9.1 Package Marking Information*XXXXXXXXT/XXXNNNYYWW8-Lead PDIP (300 mil) Example8-Lead SOIC (3.90 mm)XXXXXXXXXXXXYYWWNNN24LC04BI/P 13F1922e38-Lead 2x3 DFN ExampleXXXYWWNN234922138-Lead MSOP Example4L4BI92213FXXXXXXYWWNNNExample13F24LC04BISN 1922 e35-Lead SOT-23 (1-Line Marking) ExampleXXNN M313 2007-2019 Microchip Technology Inc. DS20001708M-page 1524AA04/24LC04B/24FC048-Lead TSSOP ExampleXXXXTYWWNNN4L04E92213F8-Lead 2x3 TDFN ExampleXXXYWWNNA34922138-Lead 2x3 UDFN ExampleXXXYWWNNADP92213Example 5-Lead SOT-23 (2-Line Marking)XXXXYYWWNNNAAEW192213F4-Ball CSP ExampleXN 31 2007-2019 Microchip Technology Inc. DS20001708M-page 1624AA04/24LC04B/24FC04Part Number1st Line Marking CodesTSSOP MSOP SOIC UDFNSOT-23 DFN TDFNCSPI-Temp. E-Temp. I-Temp. E-Temp. I-Temp. E-Temp.24AA04 4A04 4A04T(1) 24AA04T(1) — B3NN(2,3) — 231 — A31 — 3N24LC04B 4L04 4L4BT(1) 24LC04BT(1) — M3NN(2,3) N3NN(2,3) 234 235 A34 A35 —24FC04 AADR 24FC04 24FC04 ADP AAEWYY(4) AAEWYY(4) —————Note 1: T = Temperature grade (I, E)2: NN = Alphanumeric traceability code3: These parts use the 1-line SOT-23 marking format4: These parts use the 2-line SOT-23 marking formatLegend: XX...X Part number or part number codeT Temperature (I, E)Y Year code (last digit of calendar year)YY Year code (last 2 digits of calendar year)WW Week code (week of January 1 is week ‘01’)NNN Alphanumeric traceability code (2 characters for small packages)JEDEC® designator for Matte Tin (Sn)* Standard OTP marking consists of Microchip part number, year code, week code,and traceability code.Note: For very small packages with no room for the JEDEC® designator, the marking will only appear on the outer carton or reel label.Note: In the event the full Microchip part number cannot be marked on one line, itwill be carried over to the next line, thus limiting the number of availablecharacters for customer-specific information.e3e3 2007-2019 Microchip Technology Inc. DS20001708M-page 1724AA04/24LC04B/24FC04     !""#$%&'  !"#$%!&'(!%&! %(%")%%%" *&&#"%( %" + *  ) !%" & "%,-./01 / & %#%! ))%!%%,21 $& '! !)%!%%'$$&%!' 2%& %!%*") '%*$%%"%%%133)))&&3*4% 55,,& 5&% 6 67 86!&($ 6 9%./07:%  9  %"$$    .0%%*+ ,275%  /07;"% , +/0,#""5%  + < ..,#"";"% , . < .0%%;"% (  . +0%%5% 5 +  .0%%    %    ,#"" =  < <DNENOTE 11 2EXPOSED PADNOTE 12 1D2KLE2NebA3 A1ANOTE 2TOP VIEW BOTTOM VIEW ) 0    +0 2007-2019 Microchip Technology Inc. DS20001708M-page 1824AA04/24LC04B/24FC04Note: For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packaging 2007-2019 Microchip Technology Inc. DS20001708M-page 1924AA04/24LC04B/24FC04Note: For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packaging 2007-2019 Microchip Technology Inc. DS20001708M-page 2024AA04/24LC04B/24FC04Note: For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packaging 2007-2019 Microchip Technology Inc. DS20001708M-page 2124AA04/24LC04B/24FC04Note: For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packaging 2007-2019 Microchip Technology Inc. DS20001708M-page 2224AA04/24LC04B/24FC04BAFor the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingNote:Microchip Technology Drawing No. C04-018D Sheet 1 of 28-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]eBEAA1A2L8X b8X b1DE1cCPLANE.010 C1 2NNOTE 1TOP VIEWSIDE VIEW END VIEWe 2007-2019 Microchip Technology Inc. DS20001708M-page 2324AA04/24LC04B/24FC04Microchip Technology Drawing No. C04-018D Sheet 2 of 2For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingNote:8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]Units INCHESDimension Limits MIN NOM MAXNumber of Pins N 8Pitch e .100 BSCTop to Seating Plane A - - .210Molded Package Thickness A2 .115 .130 .195Base to Seating Plane A1 .015Shoulder to Shoulder Width E .290 .310 .325Molded Package Width E1 .240 .250 .280Overall Length D .348 .365 .400Tip to Seating Plane L .115 .130 .150Lead Thickness c .008 .010 .015Upper Lead Width b1 .040 .060 .070Lower Lead Width b .014 .018 .022Overall Row Spacing eB - - .430BSC: Basic Dimension. Theoretically exact value shown without tolerances.3.1.protrusions shall not exceed .010" per side.2.4.Notes:§- -Dimensions D and E1 do not include mold flash or protrusions. Mold flash orPin 1 visual index feature may vary, but must be located within the hatched area.§ Significant CharacteristicDimensioning and tolerancing per ASME Y14.5MeDATUM A DATUM Aebe2be2ALTERNATE LEAD DESIGN(VENDOR DEPENDENT) 2007-2019 Microchip Technology Inc. DS20001708M-page 2424AA04/24LC04B/24FC040.25 C A–B DCSEATINGPLANETOP VIEWSIDE VIEWVIEW A–A0.10 C0.10 CMicrochip Technology Drawing No. C04-057-SN Rev D Sheet 1 of 28XFor the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingNote:8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]1 2NhhA1A A2ABeDEE2 E12E1NOTE 5NOTE 5NX b0.10 C A–B2XH 0.23(L1)LR0.13R0.13VIEW CSEE VIEW CNOTE 1D 2007-2019 Microchip Technology Inc. DS20001708M-page 2524AA04/24LC04B/24FC04Microchip Technology Drawing No. C04-057-SN Rev D Sheet 2 of 28-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingNote:Foot Angle 0° - 8°Mold Draft Angle Bottom 5° - 15°Mold Draft Angle Top 5° - 15°Lead Width b 0.31 - 0.51Lead Thickness c 0.17 - 0.25Foot Length L 0.40 - 1.27Chamfer (Optional) h 0.25 - 0.50Overall Length D 4.90 BSCMolded Package Width E1 3.90 BSCOverall Width E 6.00 BSCStandoff A1 0.10 - 0.25Molded Package Thickness A2 1.25 - -Overall Height A - - 1.75Pitch e 1.27 BSCNumber of Pins N 8Dimension Limits MIN NOM MAXUnits MILLIMETERSprotrusions shall not exceed 0.15mm per side.3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash orREF: Reference Dimension, usually without tolerance, for information purposes only.BSC: Basic Dimension. Theoretically exact value shown without tolerances.1. Pin 1 visual index feature may vary, but must be located within the hatched area.2. § Significant Characteristic4. Dimensioning and tolerancing per ASME Y14.5MNotes:§Footprint L1 1.04 REF5. Datums A & B to be determined at Datum H. 2007-2019 Microchip Technology Inc. DS20001708M-page 2624AA04/24LC04B/24FC04RECOMMENDED LAND PATTERNMicrochip Technology Drawing C04-2057-SN Rev B8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC]BSC: Basic Dimension. Theoretically exact value shown without tolerances.Notes:1. Dimensioning and tolerancing per ASME Y14.5MFor the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingNoteimension LimitsUnitsContact Pad Spacing CContact PitchMILLIMETERS1.27 BSCMINEMAX5.40Contact Pad Length (X8)Contact Pad Width (X8)Y1X11.550.60NOMEX1CY1SILK SCREEN 2007-2019 Microchip Technology Inc. DS20001708M-page 2724AA04/24LC04B/24FC040.15 C D2XNOTE 1 1 2NTOP VIEWSIDE VIEWMicrochip Technology Drawing C04-028D [OT] Sheet 1 ofFor the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingNote:0.20 CCSEATING PLANEA A2A1eB NX b0.20 C A-B De1DE1E1/2E/2ED A0.20 C 2X(DATUM D)(DATUM A-B)AASEE SHEET 25-Lead Plastic Small Outline Transistor (OT) [SOT23] 2007-2019 Microchip Technology Inc. DS20001708M-page 2824AA04/24LC04B/24FC04Microchip Technology Drawing C04-091D [OT] Sheet 2 ofFor the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingNote:cLL1TVIEW A-ASHEET 15-Lead Plastic Small Outline Transistor (OT) [SOT23]protrusions shall not exceed 0.25mm per side.1.BSC: Basic Dimension. Theoretically exact value shown without tolerances.2.Foot AngleNumber of PinsPitchOutside lead pitchOverall HeightMolded Package ThicknessStandoffOverall WidthMolded Package WidthOverall LengthFoot LengthFootprintLead ThicknessLead WidthNotes1IbcDimension LimitsEE1DLe1AA2A1UnitsNe0°0.080.20 ---10°0.260.51MILLIMETERS0.95 BSC1.90 BSC0.300.900.89-0.60 REF2.90 BSC-2.80 BSC1.60 BSC---MIN6NOM1.451.300.150.60MAXREF: Reference Dimension, usually without tolerance, for information purposes only.Dimensions D and E1 do not include mold flash or protrusions. Mold flash orDimensioning and tolerancing per ASME Y14.5M 2007-2019 Microchip Technology Inc. DS20001708M-page 2924AA04/24LC04B/24FC04RECOMMENDED LAND PATTERN5-Lead Plastic Small Outline Transistor (OT) [SOT23]For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingNote:BSC: Basic Dimension. Theoretically exact value shown without tolerances.Notes:1. Dimensioning and tolerancing per ASME Y14.5MMicrochip Technology Drawing No. C04-2091A [OT]Dimension LimitsContact Pad Length (X5)Overall WidthDistance Between PadsContact Pad Width (X5)Contact PitchContact Pad Spacing3.901.10GZY1.700.60MIN MAXCXEUnitsNOM0.95 BSC2.80MILLIMETERSDistance Between Pads GX 0.3515XYZ CEGXG2SILK SCREEN 2007-2019 Microchip Technology Inc. DS20001708M-page 3024AA04/24LC04B/24FC04B A0.15 C0.15 C0.10 C A B0.05 C(DATUM B)(DATUM A)CSEATINGPLANENOTE 11 2N2XTOP VIEWSIDE VIEWBOTTOM VIEWNOTE 11 2N0.10 C A B0.10 C A B0.10 C0.08 CMicrochip Technology Drawing No. C04-129-MNY Rev E Sheet 1 of 22X8XFor the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingNote:8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN]DED2E2A(A3)A1e8X bLKWith 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) 2007-2019 Microchip Technology Inc. DS20001708M-page 3124AA04/24LC04B/24FC04Microchip Technology Drawing No. C04-129-MNY Rev E Sheet 2 of 28-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN]For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingNote:NOMMILLIMETERS0.50 BSC2.00 BSC3.00 BSC0.20 REF1. Pin 1 visual index feature may vary, but must be located within the hatched area.BSC: Basic Dimension. Theoretically exact value shown without tolerances.REF: Reference Dimension, usually without tolerance, for information purposes only.Contact-to-Exposed PadContact ThicknessExposed Pad WidthExposed Pad Length4. Dimensioning and tolerancing per ASME Y14.5M3. Package is saw singulated2. Package may have one or more exposed tie bars at ends.Notes:Contact WidthOverall WidthOverall LengthContact LengthStandoffNumber of PinsOverall HeightPitchK 0.20UnitsNeADimension LimitsDA3A1bD2E2EL0.201.351.250.250.000.70MIN- -0.250.301.301.401.350.300.451.4580.750.02 0.050.80MAXWith 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) 2007-2019 Microchip Technology Inc. DS20001708M-page 3224AA04/24LC04B/24FC04RECOMMENDED LAND PATTERNDimension LimitsUnitsOptional Center Pad WidthOptional Center Pad LengthContact PitchY2X21.501.60MILLIMETERS0.50 BSCMINEMAXContact Pad Length (X8)Contact Pad Width (X8)Y1X10.850.25Microchip Technology Drawing No. C04-129-MNY Rev. BNOM8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN]1 28Contact Pad Spacing 2.90 CThermal Via Diameter VThermal Via Pitch EV0.301.00BSC: Basic Dimension. Theoretically exact value shown without tolerances.Notesimensioning and tolerancing per ASME Y14.5MFor best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss duringreflow process1.2.For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingNote:CEX1Y1Y2X2EVEVØVSILK SCREENWith 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) 2007-2019 Microchip Technology Inc. DS20001708M-page 3324AA04/24LC04B/24FC04()*+),*+"-*+(. .""#$%(++-    &'  !"#$%!&'(!%&! %(%")%%%" &  ","%!"&"$ %!  "$ %!   %#".&& "+ & "%,-./01 / & %#%! ))%!%%,21 $& '! !)%!%%'$$&%!' 2%& %!%*") '%*$%%"%%%133)))&&3*4% 55,,& 5&% 6 67 86!&($ 6 9%>./07:%  < < ""** 9  .%"$$  . < .7;"% , >/0""*;"% , +  .""*5%   + +2%5% 5 . > .2%% 5 ,22% ? < 9?5"*  < 5";"% (  < +DNEE1NOTE 11 2becAA1A2L1 Lφ ) 0    9>/ 2007-2019 Microchip Technology Inc. DS20001708M-page 3424AA04/24LC04B/24FC04Note: For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packaging 2007-2019 Microchip Technology Inc. DS20001708M-page 3524AA04/24LC04B/24FC04B A0.10 C0.10 C(DATUM B)(DATUM A)CSEATINGPLANE1 2N2XTOP VIEWSIDE VIEWNOTE 11 2N0.10 C A B0.10 C A B0.10 C0.08 CMicrochip Technology Drawing C04-21355-Q4B Rev A Sheet 1 of 22X8XFor the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingNote:8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]Atmel Legacy YNZ PackageDED2E2 KL 8X bee20.10 C A B0.05 CA(A3)A1BOTTOM VIEW 2007-2019 Microchip Technology Inc. DS20001708M-page 3624AA04/24LC04B/24FC04REF: Reference Dimension, usually without tolerance, for information purposes only.BSC: Basic Dimension. Theoretically exact value shown without tolerances.1.2.3.Notesin 1 visual index feature may vary, but must be located within the hatched area.Package is saw singulatedDimensioning and tolerancing per ASME Y14.5MFor the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingNote:Number of TerminalsOverall HeightTerminal WidthOverall WidthTerminal LengthExposed Pad WidthTerminal ThicknessPitchStandoffUnitsDimension LimitsA1AbE2A3eLEN0.50 BSC0.152 REF1.200.350.180.500.000.250.401.300.550.023.00 BSCMILLIMETERSMIN NOM81.400.450.300.600.05MAXTerminal-to-Exposed-Pad K - 0.20 -Overall LengthExposed Pad LengthDD2 1.402.00 BSC1.50 1.60Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 2 of 28-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]Atmel Legacy YNZ Package 2007-2019 Microchip Technology Inc. DS20001708M-page 3724AA04/24LC04B/24FC04RECOMMENDED LAND PATTERNDimension LimitsUnitsOptional Center Pad WidthOptional Center Pad LengthContact PitchY2X21.401.60MILLIMETERS0.50 BSCMINEMAXContact Pad Length (X8)Contact Pad Width (X8)Y1X10.850.30NOM1 28Contact Pad Spacing 2.90 CContact Pad to Center Pad (X8) G1 0.20Thermal Via Diameter VThermal Via Pitch EV0.301.00BSC: Basic Dimension. Theoretically exact value shown without tolerances.Notesimensioning and tolerancing per ASME Y14.5MFor best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss duringreflow process1.2.For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packagingNote:Microchip Technology Drawing C04-21355-Q4B Rev A8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]Atmel Legacy YNZ PackageX2Y2Y1SILK SCREEN X1ECEVG2G1ØVContact Pad to Contact Pad (X6) G2 0.33 2007-2019 Microchip Technology Inc. DS20001708M-page 3824AA04/24LC04B/24FC04Note: For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packaging 2007-2019 Microchip Technology Inc. DS20001708M-page 3924AA04/24LC04B/24FC04Note: For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packaging 2007-2019 Microchip Technology Inc. DS20001708M-page 4024AA04/24LC04B/24FC04Note: For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packaging 2007-2019 Microchip Technology Inc. DS20001708M-page 4124AA04/24LC04B/24FC04APPENDIX A: REVISION HISTORYRevision M (05/2019)Corrected Part Marking for UDFN package. Addednote about exposed pad on the TDFN and UDFNpackages. Added 1st line marking code for the CSPpackage.Revision L (11/2018)Added the 24FC04 device.Revision K (03/2009)Added 4-lead Chip Scale Package Diagram and LandPattern.Revision J (03/2009)Added 4-lead Chip Scale Package.Revision H (01/2009)Added TDFN Package; Updated Package Drawings.Revision G (03/2007)Replaced Package Drawings (Rev. AM).Revision F (01/2007)Revised Features section; Changed 1.8V to 1.7V inTables and text; Revised Ambient Temperature,Section 1.0; Replaced Package Drawings; RevisedProduct ID section.Revision ERevised Figure 3-2 Control Byte Allocation; Figure 4-1Byte Write; Figure 4-2 Page Write; Section 6.0 WriteProtection; Figure 7-1 Current Address Read; Figure7-2 Random Read; Figure 7-3 Sequential Read.Revision DAdded DFN package.Revision CCorrections to Section 1.0, Electrical Characteristics. 2007-2019 Microchip Technology Inc. DS20001708M-page 4224AA04/24LC04B/24FC04NOTES: 2007-2019 Microchip Technology Inc. DS20001708M-page 4324AA04/24LC04B/24FC04THE MICROCHIP WEBSITEMicrochip provides online support via our website atwww.microchip.com. This website is used as a meansto make files and information easily available tocustomers. Accessible by using your favorite Internetbrowser, the website contains the following information:• Product Support – Data sheets and errata, application notes and sample programs, designresources, user’s guides and hardware supportdocuments, latest software releases and archivedsoftware• General Technical Support – Frequently AskedQuestions (FAQ), technical support requests,online discussion groups, Microchip consultantprogram member listing• Business of Microchip – Product selector andordering guides, latest Microchip press releases,listing of seminars and events, listings of Microchip sales offices, distributors and factory representativesCUSTOMER CHANGE NOTIFICATIONSERVICEMicrochip’s customer notification service helps keepcustomers current on Microchip products. Subscriberswill receive e-mail notification whenever there arechanges, updates, revisions or errata related to a specified product family or development tool of interest.To register, access the Microchip website atwww.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.CUSTOMER SUPPORTUsers of Microchip products can receive assistancethrough several channels:• Distributor or Representative• Local Sales Office• Field Application Engineer (FAE)• Technical SupportCustomers should contact their distributor, representative or Field Application Engineer (FAE) for support.Local sales offices are also available to help customers. A listing of sales offices and locations is included inthe back of this document.Technical support is available through the websiteat: http://microchip.com/support 2007-2019 Microchip Technology Inc. DS20001708M-page 4424AA04/24LC04B/24FC04PRODUCT IDENTIFICATION SYSTEMTo order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.Device: 24AA04: = 1.7V, 4-Kbit I2C Serial EEPROM24LC04B: = 2.5V, 4-Kbit I2C Serial EEPROM24FC04: = 1.7V, High Speed, 4-Kbit I2C SerialEEPROMTape and ReelOption:Blank = Standard packaging (tube or tray)T = Tape and Reel(1)TemperatureRange:I = -40°C to +85°C (Industrial)E = -40°C to +125°C (Extended)Package: MC = Plastic Dual Flat, No Lead Package –2x3x0.9 mm Body, 8-lead (DFN)MS = Plastic Micro Small Outline Package, 8-lead(MSOP)P = Plastic Dual In-Line – 300 mil Body, 8-lead(PDIP)SN = Plastic Small Outline - Narrow, 3.90 mm Body,8-lead (SOIC)OT = Plastic Small Outline Transistor, 5-lead(SOT-23) (Tape and Reel only)MNY = Plastic Dual Flat, No Lead Package -2x3x0.8 mm Body, 8-lead (TDFN)ST = Plastic Thin Shrink Small Outline – 4.4 mm,8-lead (TSSOP)MUY = Plastic Dual Flat, No Lead Package -2x3x0.6 mm Body, 8-lead (UDFN)CS16K(2)= Chip Scale, 4-lead (CSP)Examples:a) 24LC04BT-E/MC: Tape and Reel, ExtendedTemperature, 2.5V, DFN package.b) 24LC04BT-I/MS: Tape and Reel, IndustrialTemperature, 2.5V, MSOP package.c) 24AA04-I/P: Industrial Temperature, 1.7V,PDIP package.d) 24AA04T-I/CS16K: Tape and Reel, IndustrialTemperature, 16K(2), 1.7V, CS package.e) 24AA04-I/SN: Industrial Temperature,1.7V, SOIC package.f) 24AA04T-I/OT: Tape and Reel, IndustrialTemperature, 1.7V, SOT-23 package.g) 24AA04T-I/MNY: Tape and Reel, IndustrialTemperature, 1.7V, TDFN package.h) 24AA04T-I/ST: Tape and Reel, IndustrialTemperature, 1.7V, TSSOP package.i) 24FC04-I/P: Industrial Temperature, 1.7V,PDIP package.j) 24FC04T-I/MUY: Tape and Reel, IndustrialTemperature, 1.7V, UDFN package.PART NO. -X /XXTemperature PackageRangeDevice[X]Tape and ReelOptionNote 1: Tape and Reel identifier onlyappears in the catalog part numberdescription. This identifier is usedfor ordering purposes and is notprinted on the device package.Check with your Microchip SalesOffice for package availability withthe Tape and Reel option.2: 16K indicates 160K technology.3: Contact Microchip for Automotivegrade ordering part numbers.(1) 2007-2019 Microchip Technology Inc. DS20001708M-page 4524AA04/24LC04B/24FC04Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights unless otherwise stated.TrademarksThe Microchip name and logo, the Microchip logo, AnyRate, AVR,AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, ProchipDesigner, QTouch, SAM-BA, SpyNIC, SST, SST Logo,SuperFlash, tinyAVR, UNI/O, and XMEGA are registeredtrademarks of Microchip Technology Incorporated in the U.S.A.and other countries.ClockWorks, The Embedded Control Solutions Company,EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,mTouch, Precision Edge, and Quiet-Wire are registeredtrademarks of Microchip Technology Incorporated in the U.S.A.Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, AnyCapacitor, AnyIn, AnyOut, BodyCom, CodeGuard,CryptoAuthentication, CryptoAutomotive, CryptoCompanion,CryptoController, dsPICDEM, dsPICDEM.net, Dynamic AverageMatching, DAM, ECAN, EtherGREEN, In-Circuit SerialProgramming, ICSP, INICnet, Inter-Chip Connectivity,JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, TotalEndurance, TSHARC, USBCheck, VariSense, ViewSpan,WiperLock, Wireless DNA, and ZENA are trademarks ofMicrochip Technology Incorporated in the U.S.A. and othercountries.SQTP is a service mark of Microchip Technology Incorporated inthe U.S.A.Silicon Storage Technology is a registered trademark of MicrochipTechnology Inc. in other countries.GestIC is a registered trademark of Microchip TechnologyGermany II GmbH & Co. KG, a subsidiary of MicrochipTechnology Inc., in other countries.All other trademarks mentioned herein are property of theirrespective companies.© 2019, Microchip Technology Incorporated, All Rights Reserved.ISBN: 978-1-5224-4477-0Note the following details of the code protection feature on Microchip devices:• Microchip products meet the specification contained in their particular Microchip Data Sheet.• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in theintended manner and under normal conditions.• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to ourknowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s DataSheets. Most likely, the person doing so is engaged in theft of intellectual property.• Microchip is willing to work with the customer who is concerned about the integrity of their code.• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does notmean that we are guaranteeing the product as “unbreakable.”Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.Microchip received ISO/TS-16949:2009 certification for its worldwideheadquarters, design and wafer fabrication facilities in Chandler andTempe, Arizona; Gresham, Oregon and design centers in Californiaand India. The Company’s quality system processes and proceduresare for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hoppingdevices, Serial EEPROMs, microperipherals, nonvolatile memory andanalog products. In addition, Microchip’s quality system for the designand manufacture of development systems is ISO 9001:2000 certified. 2007-2019 Microchip Technology Inc. DS20001708M-page 46AMERICASCorporate Office2355 West Chandler Blvd.Chandler, AZ 85224-6199Tel: 480-792-7200Fax: 480-792-7277Technical Support:http://www.microchip.com/supportWeb Address:www.microchip.comAtlantaDuluth, GATel: 678-957-9614Fax: 678-957-1455Austin, TXTel: 512-257-3370BostonWestborough, MATel: 774-760-0087Fax: 774-760-0088ChicagoItasca, ILTel: 630-285-0071Fax: 630-285-0075DallasAddison, TXTel: 972-818-7423Fax: 972-818-2924DetroitNovi, MITel: 248-848-4000Houston, TXTel: 281-894-5983IndianapolisNoblesville, INTel: 317-773-8323Fax: 317-773-5453Tel: 317-536-2380Los AngelesMission Viejo, CATel: 949-462-9523Fax: 949-462-9608Tel: 951-273-7800Raleigh, NCTel: 919-844-7510New York, NYTel: 631-435-6000San Jose, CATel: 408-735-9110Tel: 408-436-4270Canada - TorontoTel: 905-695-1980Fax: 905-695-2078ASIA/PACIFICAustralia - SydneyTel: 61-2-9868-6733China - BeijingTel: 86-10-8569-7000China - ChengduTel: 86-28-8665-5511China - ChongqingTel: 86-23-8980-9588China - DongguanTel: 86-769-8702-9880China - GuangzhouTel: 86-20-8755-8029China - HangzhouTel: 86-571-8792-8115China - Hong Kong SARTel: 852-2943-5100China - NanjingTel: 86-25-8473-2460China - QingdaoTel: 86-532-8502-7355China - ShanghaiTel: 86-21-3326-8000China - ShenyangTel: 86-24-2334-2829China - ShenzhenTel: 86-755-8864-2200China - SuzhouTel: 86-186-6233-1526China - WuhanTel: 86-27-5980-5300China - XianTel: 86-29-8833-7252China - XiamenTel: 86-592-2388138China - ZhuhaiTel: 86-756-3210040ASIA/PACIFICIndia - BangaloreTel: 91-80-3090-4444India - New DelhiTel: 91-11-4160-8631India - PuneTel: 91-20-4121-0141Japan - OsakaTel: 81-6-6152-7160Japan - TokyoTel: 81-3-6880- 3770Korea - DaeguTel: 82-53-744-4301Korea - SeoulTel: 82-2-554-7200Malaysia - Kuala LumpurTel: 60-3-7651-7906Malaysia - PenangTel: 60-4-227-8870Philippines - ManilaTel: 63-2-634-9065SingaporeTel: 65-6334-8870Taiwan - Hsin ChuTel: 886-3-577-8366Taiwan - KaohsiungTel: 886-7-213-7830Taiwan - TaipeiTel: 886-2-2508-8600Thailand - BangkokTel: 66-2-694-1351Vietnam - Ho Chi MinhTel: 84-28-5448-2100EUROPEAustria - WelsTel: 43-7242-2244-39Fax: 43-7242-2244-393Denmark - CopenhagenTel: 45-4450-2828Fax: 45-4485-2829Finland - EspooTel: 358-9-4520-820France - ParisTel: 33-1-69-53-63-20Fax: 33-1-69-30-90-79Germany - GarchingTel: 49-8931-9700Germany - HaanTel: 49-2129-3766400Germany - HeilbronnTel: 49-7131-67-3636Germany - KarlsruheTel: 49-721-625370Germany - MunichTel: 49-89-627-144-0Fax: 49-89-627-144-44Germany - RosenheimTel: 49-8031-354-560Israel - Ra’ananaTel: 972-9-744-7705Italy - MilanTel: 39-0331-742611Fax: 39-0331-466781Italy - PadovaTel: 39-049-7625286Netherlands - DrunenTel: 31-416-690399Fax: 31-416-690340Norway - TrondheimTel: 47-7288-4388Poland - WarsawTel: 48-22-3325737Romania - BucharestTel: 40-21-407-87-50Spain - MadridTel: 34-91-708-08-90Fax: 34-91-708-08-91Sweden - GothenbergTel: 46-31-704-60-40Sweden - StockholmTel: 46-8-5090-4654UK - WokinghamTel: 44-118-921-5800Fax: 44-118-921-5820Worldwide Sales and Service08/15/1

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