肉包铁，经典图片！解决大部分EMC问题

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建筑的供电质量是其高效运行的关键所在。谐波干扰是建筑中的常见问题，抑制这一干扰不仅是为了满足行业标准，还可以减轻互连设备的负担，从而延长其寿命并提高能效。

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Signal Integrity Maintaining signal integrity is essential and can be achieved by controlling impedance, minimizing signal reflections and using proper termination techniques for high-speed signals. Matching trace lengths for differential signals will help to prevent skewing and ensure reliable data transmission. Always remember that the two input and output cables must never run alongside each other, they should always be crossed in orthogonal way. Of course, this is the case for all electronic applications, not just PCBs. 信号完整性 保持信号完整性至关重要，可以通过控制阻抗、最小化信号反射以及采用合适的高速信号端接技术来实现。为差分信号匹配走线长度有助于防止偏斜，并确保可靠的数据传输。请务必谨记，输入和输出线缆绝不能并排铺设，而应始终以正交方式交叉连接。当然，这适用于所有电子应用场合，而不仅仅是印制电路板。

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Stack-Up Design
This also relates to power distribution and requires engineers to optimize PCB stack-up to keep down crosstalk, impedance mismatches and EMI. Factors they need to consider include layer count, signal layer placement and using dielectric materials to achieve optimal levels of signal integrity and EMC performance.
堆叠设计
这也与电源分配有关，要求工程师优化PCB叠层设计，以降低串扰、阻抗不匹配和电磁干扰。他们需要考虑的因素包括层数、信号层的布局以及使用介电材料以达到最佳的信号完整性和电磁兼容性性能。

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孔缝设计的核心是 ​​“小、深、密、导”​：

​小：单孔尺寸≤λ/20；
​深：增加孔深或缝隙重叠；
​密：阵列孔间距最小化；
​导：导电材料填充缝隙并低阻接地

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根据统计数据，电子元器件温度每升高2℃，可靠性下降10%，温度达到50℃时的寿命只有25℃时的1/6